ENGINEERING TRIPOS PART IIB – 2012/2013
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Leader: |
Prof F Udrea (fu@eng) |
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Timing: |
Michaelmas Term |
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Prerequisites: |
None |
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Structure: |
14 Lectures +2 Examples classes |
| Assessment: | Material / Format / Timing / Marks Lecture Syllabus / Written exam (1.5 hours) / Start of Easter Term / 100 % |
AIMS
The aim of this module is to provide an introduction to the world of modern power semiconductor devices, and their applications in the electronics Industry. Covers material specific to power semiconductor devices not covered in other modules in semiconductors.
LECTURE SYLLABUS
Introduction to power electronics and power devices. Basics of power electronics, power devices and applications. P-N junction theory.
High voltage pn junction theory. Breakdown theory. None punch-through (NPT) and punch-through (PT) high voltage junction. On-state - high level injection. Lifetime. Turn-off reverse recovery
Curvature effects in high voltage junctions, Edge effects, Field plates, Terminations in power devices.
Bipolar Juction transistor (BJT).
The thyristor (concept & technology). The GTO thyristor, Switching aids for transistors and thyristors.
The power MOSFE: Concept, modes of operation. trade-offs.
The power MOSFET modelling, technologies and advanced devices.
The Insulted Gate Bipolar Transistor (IGBT): modes of operation. trade-offs.
The IGBTs, modelling, technologies and advanced concepts.
Power Intergated Circuits (PICS) and High Voltage Integrated Circuits (HVICs): introduction, lateral devices for PICs and HVICs, concepts, modes of operation.
COURSEWORK (Optional)
Finite element design and analysis of novel high voltage devices in the HVM Lab led by Dr.F.Udrea.
OBJECTIVES
On completion of the module students should:
REFERENCES
Please see the Booklist for Group F Courses for references for this module.
Last updated: May 2012